Invention Grant
- Patent Title: Optical module
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Application No.: US16470614Application Date: 2017-01-20
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Publication No.: US10916912B2Publication Date: 2021-02-09
- Inventor: Hiroshi Itakura , Keitaro Yamagishi , Yoshihiro Akeboshi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- International Application: PCT/JP2017/001928 WO 20170120
- International Announcement: WO2018/134967 WO 20180726
- Main IPC: H01S5/022
- IPC: H01S5/022 ; G02B6/42 ; H01L23/31 ; H01L31/0203 ; H01S5/0683 ; H05K1/18

Abstract:
There are included a CAN package (2) having a stem (22) and lead pins (23a and 23b) protruding from the stem (22), and a board (3) having pads (33a and 33b) for connecting lead pin. The CAN package (2) has a slot (222) provided in a surface of the stem (22) from which the lead pins (23a and 23b) protrude. One end of the board (3) is inserted into the slot (222), and the pads (33a and 33b) for connecting lead pin are electrically connected to the lead pins (23a and 23b).
Public/Granted literature
- US20190334313A1 OPTICAL MODULE Public/Granted day:2019-10-31
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