Invention Grant
- Patent Title: Semiconductor integrated circuit and method of manufacturing the same
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Application No.: US16362038Application Date: 2019-03-22
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Publication No.: US10916624B2Publication Date: 2021-02-09
- Inventor: Yoshiaki Toyoda
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JP2018-95166 20180517
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L21/762 ; H01L27/088

Abstract:
A semiconductor integrated circuit includes: an n−-type support layer; a p-type well region provided in an upper portion of the support layer; a p+-type circuit side buried layer provided inside the well region; an n+-type first and second terminal regions provided in an upper portion of the well region and above the circuit side buried layer; a p-type body region provided in an upper portion of the support layer; a control electrode structure provided in a gate trench; a p+-type output side buried layer provided inside the body region so as to be in contact with the control electrode structure; and an n+-type output terminal region provided in an upper portion of the body region and above the output side buried layer, wherein an output stage element having the output terminal region is controlled by a circuit element including the first and second terminal regions.
Public/Granted literature
- US20190355808A1 SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-11-21
Information query
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