Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
-
Application No.: US16312814Application Date: 2018-09-03
-
Publication No.: US10916570B2Publication Date: 2021-02-09
- Inventor: Ching Fu Chien
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangdong
- Agent Leong C. Lei
- Priority: CN201810809157 20180720
- International Application: PCT/CN2018/103812 WO 20180903
- International Announcement: WO2020/015071 WO 20200123
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/12 ; G02F1/1362 ; H01L27/32

Abstract:
Provided are an array substrate and a manufacturing method thereof. A first wire of a fanout line of the array substrate is divided into a plurality of first sections. A second wire of the fanout line is divided into a plurality of second sections corresponding to the first sections. Each of the first sections is electrically connected to the second section corresponding thereof. Thus, as a certain position of the first wire or the second wire is broken, only a resistance of the first section or the second section where the broken position is located is changed, so that a blocking effect on the entire fanout lines is not large, thereby reducing or avoiding appearance of a light line.
Information query
IPC分类: