Invention Grant
- Patent Title: Method and system for providing a reverse engineering resistant hardware embedded security module
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Application No.: US16453475Application Date: 2019-06-26
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Publication No.: US10916513B2Publication Date: 2021-02-09
- Inventor: Harsono S. Simka , Ganesh Hegde , Joon Goo Hong , Rwik Sengupta , Mark S. Rodder
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/522 ; H01L27/02 ; H04L9/32 ; H01L23/532 ; G09C1/00
Abstract:
A hardware-embedded security system is described. The system includes connective components, circuit elements and an insulator. The connective components include a variable conductivity layer that is conductive for a first stoichiometry and insulating for a second stoichiometry. A first portion of the circuit elements are connected to a first portion of the connective components and are active. A the second portion of the circuit elements are connected to a second portion of the connective components and are inactive. The insulator is adjacent to at least a portion of each of the connective components. The first stoichiometry is indistinguishable from the second stoichiometry via optical imaging and electron imaging of a portion of the insulator and the variable conductivity layer.
Public/Granted literature
- US20190318998A1 METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HARDWARE EMBEDDED SECURITY MODULE Public/Granted day:2019-10-17
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