A device that includes a first die and a package substrate. The package substrate includes a dielectric layer, a plurality of vias formed in the dielectric layer, a first plurality of interconnects formed on a first metal layer of the package substrate, and a second plurality of interconnects formed on a second metal layer of the package substrate. The device includes a first series of first solder interconnects arranged in a first direction, the first series of first solder interconnects configured to provide a first electrical connection; a second series of first solder interconnects arranged in the first direction, the second series of first solder interconnects configured to provide a second electrical connection; a first series of second solder interconnects arranged in a second direction, the first series of second solder interconnects configured to provide the first electrical connection.