- Patent Title: Electronic device including redistribution layer pad having a void
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Application No.: US16014745Application Date: 2018-06-21
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Publication No.: US10916484B2Publication Date: 2021-02-09
- Inventor: Robert Fehler , Francesca Arcioni , Christian Geissler , Walter Hartner , Gerhard Haubner , Thorsten Meyer , Martin Richard Niessner , Maciej Wojnowski
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102017210654 20170623
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L21/683 ; H01L23/538 ; H01L21/56
Abstract:
An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.
Public/Granted literature
- US20180374769A1 ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID Public/Granted day:2018-12-27
Information query
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