Invention Grant
- Patent Title: 3D flash memory module and healing and operating methods of 3D flash memory
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Application No.: US16784154Application Date: 2020-02-06
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Publication No.: US10916308B2Publication Date: 2021-02-09
- Inventor: Hang-Ting Lue
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: G11C16/14
- IPC: G11C16/14 ; G11C16/04 ; G11C5/02

Abstract:
A three-dimensional (3D) flash memory module, a healing method of 3D flash memory, and an operating method of 3D flash memory are provided. The 3D flash memory module includes a 3D flash memory structure and a conductive layer. The 3D flash memory structure is disposed on a substrate. The conductive layer is disposed on the substrate and is adjacent to at least one side wall of the 3D flash memory structure. The conductive layer extends along the at least one side wall of the 3D flash memory structure, and each of two opposite end portions of the conductive layer has an electrical connection point in an extending direction of the conductive layer.
Public/Granted literature
- US20200381050A1 3D FLASH MEMORY MODULE AND HEALING AND OPERATING METHODS OF 3D FLASH MEMORY Public/Granted day:2020-12-03
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