Invention Grant
- Patent Title: Fan drive circuit for heat pump device
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Application No.: US16076891Application Date: 2016-12-22
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Publication No.: US10914482B2Publication Date: 2021-02-09
- Inventor: Akiyoshi Yamamoto , Kazushige Maeda
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2016-083088 20160418
- International Application: PCT/JP2016/088355 WO 20161222
- International Announcement: WO2017/183234 WO 20171026
- Main IPC: F24F11/36
- IPC: F24F11/36 ; F24F11/74 ; F24F11/88 ; F25B49/02 ; F25B1/00

Abstract:
A fan drive circuit 1 for a heat pump device is provided. The heat pump device blows air heat exchanged by a heat exchanger using a mildly-flammable or flammable refrigerant having a specific gravity greater than that of air from a blowout port using a fan. The fan drive circuit 1 is equipped with a forced operation circuit configured to operate the fan in the event that it is undetectable that a protection device for preventing a leaked refrigerant from the heat pump device from reaching a combustible density is connected to the heat pump device.
Public/Granted literature
- US20190086111A1 FAN DRIVE CIRCUIT FOR HEAT PUMP DEVICE Public/Granted day:2019-03-21
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