Invention Grant
- Patent Title: Configurable power combiner and splitter
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Application No.: US15940888Application Date: 2018-03-29
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Publication No.: US10910714B2Publication Date: 2021-02-02
- Inventor: Bon-Hyun Ku , Jeremy Dunworth
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated/Seyfarth Shaw LLP
- Main IPC: H01Q5/335
- IPC: H01Q5/335 ; H01Q1/22 ; H01Q21/30 ; H04B1/00 ; H03H7/48 ; H01Q21/28 ; H04B1/44 ; H03F1/02 ; H03F1/56 ; H03F3/21 ; H03F3/68 ; H03G1/00 ; H04B1/525 ; H01Q21/06 ; H01Q1/24

Abstract:
A signal processing circuit reduces die size and power consumption for each antenna element. The signal processing circuit includes a first set of ports, a third port, a first path, a second path and a first transistor. The first path is between a first port of the first set of ports and the third port. The second path is between a second port of the first set of ports and the third port. The first transistor is coupled between the first path and the second path. The first transistor is configured to receive a control signal to control the first transistor to adjust an impedance between the first path and the second path.
Public/Granted literature
- US20190081399A1 CONFIGURABLE POWER COMBINER AND SPLITTER Public/Granted day:2019-03-14
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