Invention Grant
- Patent Title: Solid-state imaging element, imaging device, and method for manufacturing solid-state imaging element
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Application No.: US15777853Application Date: 2016-09-28
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Publication No.: US10910504B2Publication Date: 2021-02-02
- Inventor: Sozo Yokogawa
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JP2015-238216 20151207
- International Application: PCT/JP2016/078614 WO 20160928
- International Announcement: WO2017/098779 WO 20170615
- Main IPC: H01L31/0236
- IPC: H01L31/0236 ; H01L27/14 ; H01L27/146 ; G02B5/20 ; G02B5/30 ; H04N5/225 ; H04N5/369 ; H04N5/235 ; G02B5/22 ; G02B5/26

Abstract:
[Object] To propose a solid-state imaging element, an imaging device, and a method for manufacturing a solid-state imaging element that are capable of providing a pixel with polarization sensitivity while suppressing the reduction in sensitivity to non-polarized incident light. [Solution] A solid-state imaging element according to the present disclosure includes: a light receiving element included in a plurality of pixels; and a groove section provided on surfaces of at least some of the pixels in the light receiving element and extended along a prescribed direction. Two or more directions including at least mutually orthogonal two directions exist as a direction in which the groove section is extended.
Public/Granted literature
- US20180351013A1 SOLID-STATE IMAGING ELEMENT, IMAGING DEVICE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT Public/Granted day:2018-12-06
Information query
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