Invention Grant
- Patent Title: LDMOS devices, integrated circuits including LDMSO devices, and methods for fabricating the same
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Application No.: US16167842Application Date: 2018-10-23
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Publication No.: US10910377B2Publication Date: 2021-02-02
- Inventor: Guowei Zhang
- Applicant: Globalfoundries Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Globalfoundries Singapore Pte. Ltd.
- Current Assignee: Globalfoundries Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/40 ; H01L29/10 ; H01L27/092 ; H01L29/08 ; H01L21/8238 ; H01L29/51

Abstract:
Laterally-diffused-metal-oxide-silicon (LDMOS) devices, integrated circuits including LDMOS devices, and methods for fabricating the same are provided. An exemplary LDMOS device includes a substrate having a surface, a gate structure overlying the surface and a channel region in the substrate below the gate structure, and a drain region in the substrate. The LDMOS device further includes a surface insulator region disposed between the gate structure and the drain region at the surface of the substrate and a dielectric block different from the surface insulator region and located over the surface insulator region. Also, the LDMOS device includes a field effect structure. The field effect structure includes a field plate disposed over and distanced from the surface of the substrate. The field effect structure also includes a conductive structure coupled to the field plate and extending from the field plate toward the dielectric block.
Information query
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