Invention Grant
- Patent Title: 3D stacked integrated circuits having functional blocks configured to accelerate artificial neural network (ANN) computation
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Application No.: US16561486Application Date: 2019-09-05
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Publication No.: US10910366B2Publication Date: 2021-02-02
- Inventor: Tony M. Brewer
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Greenberg Traurig
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L27/06 ; H01L25/065 ; H01L25/10 ; H01L21/768 ; H01L23/495 ; H01L23/31

Abstract:
A three-dimensional stacked integrated circuit (3D SIC) for implementing an artificial neural network (ANN) having a memory die having an array of memory partitions. Each partition of the array of memory partitions is configured to store parameters of a set of neurons. The 3D SIC also has a processing logic die having an array of processing logic partitions. Each partition of the array of processing logic partitions is configured to: receive input data, and process the input data according to the set of neurons to generate output data.
Information query
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