Invention Grant
- Patent Title: Thermal management system
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Application No.: US16555764Application Date: 2019-08-29
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Publication No.: US10910243B2Publication Date: 2021-02-02
- Inventor: Tejas Ulavi , Dhritiman Subha Kashyap , Sanjeev Baluja
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F28F3/14 ; F28F27/02 ; G01K13/02 ; G01K7/02
Abstract:
A thermal management system comprising a fluid channel with a plurality of parallel first flow paths extending along a first level in a first thermal mass and a plurality of parallel second flow paths extending along a second level in a second thermal mass are described. Methods for controlling the temperature of a substrate or heater surface and fluid manifolds are also described.
Public/Granted literature
- US20200075366A1 Thermal Management System Public/Granted day:2020-03-05
Information query
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