Invention Grant
- Patent Title: Multi-core electronic system
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Application No.: US16231420Application Date: 2018-12-22
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Publication No.: US10909056B2Publication Date: 2021-02-02
- Inventor: Wen-Pin Chiang
- Applicant: VIA Technologies, Inc.
- Applicant Address: TW New Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW107133255A 20180920
- Main IPC: G06F13/28
- IPC: G06F13/28 ; G06F15/78 ; G06F13/40

Abstract:
An architecture of a multi-core electronic system is provided. The architecture includes a plurality of first computing cores, a first ring bus, a direct memory access (DMA) engine, and a DMA ring controller. The first computing cores are connected to the first ring bus. The DMA ring controller connects the DMA engine to the first ring bus. The first computing cores communicate with the DMA engine through the first ring bus and make the DMA engine perform a memory operation.
Public/Granted literature
- US20200097423A1 MULTI-CORE ELECTRONIC SYSTEM Public/Granted day:2020-03-26
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