Invention Grant
- Patent Title: Polyamide resin composition, kit, method for manufacturing molded article, and molded article
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Application No.: US16064970Application Date: 2016-11-28
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Publication No.: US10907042B2Publication Date: 2021-02-02
- Inventor: Fumihito Okamoto
- Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Current Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-254960 20151225
- International Application: PCT/JP2016/085149 WO 20161128
- International Announcement: WO2017/110372 WO 20170629
- Main IPC: C08L77/06
- IPC: C08L77/06 ; C08G69/26 ; C08K7/14 ; B29C65/16 ; B29C65/00 ; B29C65/82 ; C08K5/00 ; C08K3/34 ; G03B17/02
Abstract:
Provided is a polyamide resin composition that has a large light transmittance with respect to 940 nm laser beam, and is capable of yielding a molded article that is highly laser weldable; and a kit, a method for manufacturing a molded article, and a molded article, using such polyamide resin composition.
Public/Granted literature
- US20190002692A1 POLYAMIDE RESIN COMPOSITION, KIT, METHOD FOR MANUFACTURING MOLDED ARTICLE, AND MOLDED ARTICLE Public/Granted day:2019-01-03
Information query
