Invention Grant
- Patent Title: Method of manufacturing clad metal casing
-
Application No.: US15959416Application Date: 2018-04-23
-
Publication No.: US10905022B2Publication Date: 2021-01-26
- Inventor: San-Feng Lin , Chen-Sheng Chung
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: CN201710274086 20170425
- Main IPC: H05K5/04
- IPC: H05K5/04 ; H05K5/02 ; B32B15/04 ; B29C45/14 ; B29L31/34 ; B21C23/06 ; B21J1/02
Abstract:
A method of manufacturing a clad metal casing includes the steps of arranging and connecting metallic materials with different types from each other to form a clad board; shaping the clad board; and post-process the appearance surface of the formed clad board to form the clad metal casing. The appearance surface after the post-process presents surfaces of at least two metallic materials.
Public/Granted literature
- US20180310424A1 METHOD OF MANUFACTURING CLAD METAL CASING Public/Granted day:2018-10-25
Information query
