Invention Grant
- Patent Title: Coil assembly and induction heating device including a coil assembly
-
Application No.: US16018167Application Date: 2018-06-26
-
Publication No.: US10904957B2Publication Date: 2021-01-26
- Inventor: Heejun Lee
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2017-0080802 20170626
- Main IPC: H05B6/12
- IPC: H05B6/12 ; H05B6/36
Abstract:
A coil assembly and an induction heating device including a coil assembly are provided. The coil assembly may include a coil frame having a shape corresponding to a shape of a heating region defined in a plate. A working coil may extend alternately in between opposite first and second directions, rather than being circularly arranged as in related art coil assemblies.
Public/Granted literature
- US20180376547A1 COIL ASSEMBLY AND INDUCTION HEATING DEVICE INCLUDING A COIL ASSEMBLY Public/Granted day:2018-12-27
Information query
