- Patent Title: Schottky semiconductor device with junction termination extensions
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Application No.: US16482437Application Date: 2017-11-13
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Publication No.: US10903374B2Publication Date: 2021-01-26
- Inventor: Hidenori Kitai , Hiromu Shiomi , Kenji Fukuda
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: IPUSA, PLLC
- Priority: JP2017-050319 20170315
- International Application: PCT/JP2017/040767 WO 20171113
- International Announcement: WO2018/168069 WO 20180920
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/06 ; H01L29/16

Abstract:
A semiconductor device includes a first JTE region formed around an active portion, a second JTE region formed around the first JTE region, and a third JTE region formed around the second JTE region. The first, second, and third JTE regions are doped with an impurity of a second conductivity type different from a first conductivity type. A concentration ratio R21 “(concentration of impurity in second JTE region)/(concentration of impurity in first JTE region)” and a concentration ratio R32 “(concentration of impurity in third JTE region)/(concentration of impurity in second JTE region)” are 0.50 or greater and 0.65 or less. A width W1 of the first JTE region, a width W2 of the second JTE region, and a width W3 of the third JTE region are 130 μm or greater and 190 μm or less.
Public/Granted literature
- US20200251600A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-08-06
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