Invention Grant
- Patent Title: Transistor channel having vertically stacked nanosheets coupled by fin-shaped bridge regions
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Application No.: US16286733Application Date: 2019-02-27
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Publication No.: US10903369B2Publication Date: 2021-01-26
- Inventor: Ruilong Xie , Julien Frougier , Chanro Park , Edward Nowak , Yi Qi , Kangguo Cheng , Nicolas Loubet
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Joseph Petrokaitis
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L21/30 ; H01L29/423 ; H01L21/225 ; H01L21/762

Abstract:
Embodiments of the present invention are directed to techniques for providing an novel field effect transistor (FET) architecture that includes a center fin region and one or more vertically stacked nanosheets. In a non-limiting embodiment of the invention, a non-planar channel region is formed having a first semiconductor layer, a second semiconductor layer, and a fin-shaped bridge layer between the first semiconductor layer and the second semiconductor layer. Forming the non-planar channel region can include forming a nanosheet stack over a substrate, forming a trench by removing a portion of the nanosheet stack, and forming a third semiconductor layer in the trench. Outer surfaces of the first semiconductor layer, the second semiconductor layer, and the fin-shaped bridge region define an effective channel width of the non-planar channel region.
Public/Granted literature
- US20200274000A1 TRANSISTOR CHANNEL HAVING VERTICALLY STACKED NANOSHEETS COUPLED BY FIN-SHAPED BRIDGE REGIONS Public/Granted day:2020-08-27
Information query
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