Invention Grant
- Patent Title: Vertical FET with shaped spacer to reduce parasitic capacitance
-
Application No.: US16684050Application Date: 2019-11-14
-
Publication No.: US10903338B2Publication Date: 2021-01-26
- Inventor: Junli Wang , Kangguo Cheng , Theodorus E. Standaert , Veeraraghavan S. Basker
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Randall Bluestone
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/423 ; H01L29/78

Abstract:
A vertical transistor includes a first source/drain region and a second source/drain region vertically disposed relative to the first source/drain region and coupled to the first source/drain region by a fin. A gate dielectric is formed on the fin, and a gate conductor is formed on the gate dielectric in a region of the fin. A shaped spacer is configured to cover a lower portion and sides of the second source/drain region to reduce parasitic capacitance between the gate conductor and the second source/drain region.
Public/Granted literature
- US20200083347A1 VERTICAL FET WITH SHAPED SPACER TO REDUCE PARASITIC CAPACITANCE Public/Granted day:2020-03-12
Information query
IPC分类: