A semiconductor module is provided to include: a plurality of semiconductor chips; a lead frame that is connected to the plurality of semiconductor chips; and a main terminal that is connected to the lead frame, wherein the lead frame has an electrical connection portion that electrically connects the plurality of semiconductor chips to the main terminal, and a heat dissipation portion that is provided to extend from the electrical connection portion. The heat dissipation portion does not extend a path of a current that flows between the main terminal and the plurality of semiconductor chips.