Invention Grant
- Patent Title: Package structure having a plurality of insulating layers
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Application No.: US16183128Application Date: 2018-11-07
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Publication No.: US10903136B2Publication Date: 2021-01-26
- Inventor: Ming-Hung Wu , Chi-Fu Wu , An-Ping Tseng , Hao-Yu Wu
- Applicant: TDK TAIWAN CORP.
- Applicant Address: TW Taoyuan
- Assignee: TDK TAIWAN CORP.
- Current Assignee: TDK TAIWAN CORP.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201821729019U 20181024
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/48 ; H01L21/4763 ; H01L23/373 ; H01L23/367 ; H01L23/522 ; H01L23/532 ; H01L23/538 ; H01L21/768 ; H01L23/498 ; H01L23/528 ; H01L21/48 ; H01L23/00
Abstract:
A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.
Public/Granted literature
- US20190139860A1 PACKAGE STRUCTURE Public/Granted day:2019-05-09
Information query
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