Invention Grant
- Patent Title: Coil electronic component
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Application No.: US15988497Application Date: 2018-05-24
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Publication No.: US10902994B2Publication Date: 2021-01-26
- Inventor: Chi Seong Kim , Jun Il Kang , Sa Yong Lee , Gun Hwi Hyung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0134635 20171017
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F41/04 ; H01F27/32 ; H01F17/00 ; H05K1/18

Abstract:
A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.
Public/Granted literature
- US20190115145A1 COIL ELECTRONIC COMPONENT Public/Granted day:2019-04-18
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