Invention Grant
- Patent Title: Electrolytic copper foil for graphene and method for producing the copper foil
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Application No.: US16088840Application Date: 2017-03-21
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Publication No.: US10826117B2Publication Date: 2020-11-03
- Inventor: Tae Jin Jo , Sun Hyoung Lee , Seul-Ki Park , Ki Deok Song
- Applicant: ILJIN MATERIALS CO., LTD.
- Applicant Address: KR Iksan
- Assignee: ILJIN MATERIALS CO., LTD.
- Current Assignee: ILJIN MATERIALS CO., LTD.
- Current Assignee Address: KR Iksan
- Agency: Patent Office of Dr. Chung Park
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4a180ecd
- International Application: PCT/KR2017/003006 WO 20170321
- International Announcement: WO2017/188600 WO 20171102
- Main IPC: B21C37/02
- IPC: B21C37/02 ; H01M10/0562 ; C25D3/38 ; C01B32/184 ; C25D1/04 ; C25D7/06 ; B82Y30/00 ; B82Y40/00

Abstract:
The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil. More particularly, the present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, which may facilitate formation of graphene by blocking surface deformation during the electrolytic copper foil formation. In accordance with the present disclosure, the Rz roughness of the S-face of the electrolytic copper foil after 1 hour treatment at 200° C. in the synthesis of graphene on the electrolytic copper foil is defined based on the Relationship 1 below. This may also minimize the deformation of the surface of the electrolytic copper foil at high temperatures: 0.05≤(Rz roughness of M-face of electrolytic copper foil/Rz roughness of S-face after treatment at 200° C. for 1 hour)/thickness of electrolytic copper foil≤0.2. Relationship 1:
Public/Granted literature
- US20190088992A1 ELECTROLYTIC COPPER FOIL FOR GRAPHENE AND METHOD FOR PRODUCING THE COPPER FOIL Public/Granted day:2019-03-21
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