Invention Grant
- Patent Title: LED lead frame structure
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Application No.: US15942878Application Date: 2018-04-02
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Publication No.: US10825973B2Publication Date: 2020-11-03
- Inventor: Chih-Kai Chang , Qiang Lee , Yao-Ching Huang
- Applicant: U.D.ELECTRONIC CORP. , U.D.(DONGGUAN) ELECTRONIC TECHNOLOGY CORP. , U.D.(ZHONG JIANG) ELECTRONIC CORP.
- Applicant Address: TW Taoyuan CN Dongguan CN Deyang
- Assignee: U.D. ELECTRONIC CORP.,U.D. (DONGGUAN) ELECTRONIC TECHNOLOGY CORP.,U.D. (ZHONG JIANG) ELECTRONIC CORP.
- Current Assignee: U.D. ELECTRONIC CORP.,U.D. (DONGGUAN) ELECTRONIC TECHNOLOGY CORP.,U.D. (ZHONG JIANG) ELECTRONIC CORP.
- Current Assignee Address: TW Taoyuan CN Dongguan CN Deyang
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4505395
- Main IPC: H01L33/62
- IPC: H01L33/62
Abstract:
An LED lead frame structure includes a lamp body, and a stamped metal frame including transversely spaced and longitudinally extended first longitudinal frame portion and second longitudinal frame portion, longitudinally spaced and transversely extended first transverse frame portion and second transverse frame portion and a material strip frame. The first transverse frame portion is integrally connected to a rear end of the first longitudinal frame portion. The second transverse frame portions integrally connected to a rear end of the second longitudinal frame portion. This product can be regarded as a semi-finished product having a bendable structure and can be bent again if necessary, and thus, this design can reduce the number of times in bending lamp pins.
Public/Granted literature
- US20180301607A1 LED LEAD FRAME STRUCTURE Public/Granted day:2018-10-18
Information query
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