Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16228809Application Date: 2018-12-21
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Publication No.: US10825904B2Publication Date: 2020-11-03
- Inventor: Yasunori Agata , Takashi Yoshimura , Hiroshi Takishita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1850216d
- Main IPC: H01L29/227
- IPC: H01L29/227 ; H01L29/36 ; H01L29/861 ; H01L27/07 ; H01L29/10 ; H01L21/265 ; H01L29/739 ; H01L29/78 ; H01L29/868 ; H01L29/06

Abstract:
Provided is a semiconductor device including a buffer region. Provided is a semiconductor device including: semiconductor substrate of a first conductivity type; a drift layer of the first conductivity type provided in the semiconductor substrate; and a buffer region of the first conductivity type provided in the drift layer, the buffer region having a plurality of peaks of a doping concentration, wherein the buffer region has: a first peak which has a predetermined doping concentration, and is provided the closest to a back surface of the semiconductor substrate among the plurality of peaks; and a high-concentration peak which has a higher doping concentration than the first peak, and is provided closer to an upper surface of the semiconductor substrate than the first peak is.
Public/Granted literature
- US20190148500A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-05-16
Information query
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