Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15642928Application Date: 2017-07-06
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Publication No.: US10825713B2Publication Date: 2020-11-03
- Inventor: Naohiko Yoshihara , Kenji Kobayashi , Manabu Okutani
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@67717637 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2782a983 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@645f7cfa com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27eb8e53
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/687 ; H01L21/67 ; B05C11/08

Abstract:
A substrate processing apparatus includes a substrate heating unit arranged to heat the underside of a substrate while supporting the substrate thereon and an attitude changing unit arranged to cause the substrate heating unit to undergo an attitude change between a horizontal attitude and a tilted attitude. In an organic solvent removing step to be performed following a substrate heating step of heating the substrate, the substrate heating unit undergoes an attitude change to the tilted attitude so that the upper surface of the substrate becomes tilted with respect to the horizontal surface.
Public/Granted literature
- US20170301580A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-10-19
Information query
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