Invention Grant
- Patent Title: Vacuum chuck and semiconductor manufacturing apparatus having the same
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Application No.: US16151485Application Date: 2018-10-04
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Publication No.: US10825712B2Publication Date: 2020-11-03
- Inventor: Young-min Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6c4ea389
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/68 ; H01L21/00 ; B23B31/30
Abstract:
A vacuum chuck includes an adsorption plate including porous materials, a housing including an accommodation part, a plurality of adsorption grooves, and a vacuum opening formed in the accommodation part. The adsorption plate is disposed in the accommodation part, and the plurality of adsorption grooves each have an arc shape and is formed in a surface of the accommodation part. The vacuum chuck further includes a vacuum line configured to supply vacuum pressure to the vacuum opening.
Public/Granted literature
- US20190252233A1 VACUUM CHUCK AND SEMICONDUCTOR MANUFACTURING APPARATUS HAVING THE SAME Public/Granted day:2019-08-15
Information query
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