Invention Grant
- Patent Title: Electrostatic chuck and plasma processing apparatus
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Application No.: US15987110Application Date: 2018-05-23
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Publication No.: US10825660B2Publication Date: 2020-11-03
- Inventor: Shin Yamaguchi , Akiyoshi Mitsumori
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@473c47b5
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H02N13/00 ; C23C16/458 ; H01L21/683 ; H01L21/687 ; H01L21/67

Abstract:
An electrostatic chuck of an embodiment includes a base, a dielectric layer, and a chuck main body. The dielectric layer is provided on the base, and is fixed to the base. The chuck main body is mounted on the dielectric layer. The chuck main body has a ceramic main body, a first electrode, a second electrode, and a third electrode. The ceramic main body has a substrate mounting region. The first electrode is provided in the substrate mounting region. The second electrode and the third electrode form a bipolar electrode. The second electrode and the third electrode are provided in the ceramic main body, and are provided between the first electrode and the dielectric layer.
Public/Granted literature
- US20180350561A1 ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS Public/Granted day:2018-12-06
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