Invention Grant
- Patent Title: Magnetic random access memory structure and manufacturing method of the same
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Application No.: US16683080Application Date: 2019-11-13
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Publication No.: US10825499B2Publication Date: 2020-11-03
- Inventor: Harry-Hak-Lay Chuang , Sheng-Chang Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C11/16 ; H01L27/22 ; H01L43/12 ; H01L43/10 ; G11C11/00 ; H01L43/08

Abstract:
The present disclosure provides a magnetic random access memory structure, including an array region, and a logic region adjacent to the array region. The logic region includes a bottom electrode via, a magnetic tunneling junction layer over the bottom electrode via, a top electrode over the MTJ, a conformable oxide layer over the MTJ and the top electrode, and a silicon oxide layer over the conformable oxide layer. The conformable oxide layer and the silicon oxide layer extend from the array region to the logic region.
Public/Granted literature
- US20200082860A1 MAGNETIC RANDOM ACCESS MEMORY STRUCTURE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2020-03-12
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