A method of forming an integrated assembly includes providing a construction having laterally-spaced digit-line-contact-regions and having intervening regions between the laterally-spaced digit-line-contact-regions; forming an expanse of non-conductive-semiconductor-material which extends across the digit-line-contact-regions and the intervening regions; a lower surface of the non-conductive-semiconductor-material being vertically-spaced from upper surfaces of the digit-line-contact-regions; forming openings extending through the non-conductive-semiconductor-material to the digit-line-contact-regions; forming conductive-semiconductor-material-interconnects within the openings and coupled with the digit-line-contact-regions, upper surfaces of the conductive-semiconductor-material-interconnects being beneath the lower surface of the non-conductive-semiconductor-material; and forming metal-containing-digit-lines over the non-conductive-semiconductor-material.