The present disclosure is directed to a mold assembly for vacuum forming a component. The mold assembly includes plurality of support plates and a plurality of mold plates removably coupled to the plurality of support plates. The plurality of mold plates is stacked and removably coupled together to form a mold configured for forming the component. Each mold plate including a first surface partially defining a top surface of the mold, a second surface spaced apart from the first surface, a third surface extending from the first surface to the second surface, and a fourth surface spaced apart from the third surface and extending from the first surface to the second surface.