Invention Grant
- Patent Title: Modular system (switch boards and mid-plane) for supporting 50G or 100G ethernet speeds of FPGA+SSD
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Application No.: US16202079Application Date: 2018-11-27
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Publication No.: US10805095B2Publication Date: 2020-10-13
- Inventor: Sompong Paul Olarig
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Main IPC: H04L12/04
- IPC: H04L12/04 ; H03K19/173 ; H04L12/44 ; G06F30/331 ; G06F13/40 ; G06F13/38
Abstract:
A chassis front-end is disclosed. The chassis front-end may include a switchboard including an Ethernet switch, a Baseboard Management Controller, and a mid-plane connector. The chassis front-end may also include a mid-plane including at least one storage device connector and a speed logic to inform at least one storage device of an Ethernet speed of the chassis front-end. The Ethernet speeds may vary.
Public/Granted literature
- US12301372B2 Modular system (switch boards and mid-plane) for supporting 50G or 100G ethernet speeds of FPGA+SSD Public/Granted day:2025-05-13
Information query
