Invention Grant
- Patent Title: Resistive random access memory and manufacturing method thereof
-
Application No.: US16123234Application Date: 2018-09-06
-
Publication No.: US10804465B2Publication Date: 2020-10-13
- Inventor: Huaqiang Wu , Wei Wu , Bin Gao , He Qian
- Applicant: Tsinghua University
- Applicant Address: CN Beijing
- Assignee: TSINGHUA UNIVERSITY
- Current Assignee: TSINGHUA UNIVERSITY
- Current Assignee Address: CN Beijing
- Agency: Loeb & Loeb LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5444af20
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
A resistive random access memory and a manufacture method thereof are provided. The resistive random access memory includes: a first electrode, a second electrode, a resistive layer between the first electrode and the second electrode, and at least one thermal enhanced layer; the thermal enhanced layer is adjacent to the resistive layer, and a thermal conductivity of the thermal enhanced layer is less than a thermal conductivity of the first electrode and a thermal conductivity of the second electrode.
Public/Granted literature
- US20190074435A1 RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-03-07
Information query
IPC分类: