Invention Grant
- Patent Title: Dual-sided memory module with channels aligned in opposition
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Application No.: US16243563Application Date: 2019-01-09
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Publication No.: US10804243B2Publication Date: 2020-10-13
- Inventor: James D. Kelly , William H. Radke , Steven J. Sfarzo
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H01L25/065 ; H01L23/00 ; H01L23/538 ; G11C5/04 ; G11C5/06 ; G11C11/417 ; H01L25/10 ; H05K1/02
Abstract:
Memory packages, memory modules, and circuit boards are described. In an embodiment, single channel memory packages are mounted on opposite sides of a circuit board designed with a first side also designed to accept dual channel memory packages. Alternatively, dual channel memory packages may be mounted on a first side of a circuit board that is also designed to accept single channel packages on opposite sides.
Public/Granted literature
- US20190198480A1 DUAL-SIDED MEMORY MODULE WITH CHANNELS ALIGNED IN OPPOSITION Public/Granted day:2019-06-27
Information query
