Invention Grant
- Patent Title: High temperature superconducting wires having increased engineering current densities
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Application No.: US15593835Application Date: 2017-05-12
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Publication No.: US10804010B2Publication Date: 2020-10-13
- Inventor: Martin W. Rupich
- Applicant: American Superconductor Corporation
- Agency: Verrill
- Agent John W. Powell
- Main IPC: H01B12/14
- IPC: H01B12/14 ; H01L39/24 ; H01L39/14 ; H01L39/12

Abstract:
A superconductor wire having a first HTS layer with a first cap layer in direct contact with a first surface of the first HTS layer and a second cap layer in direct contact with a second surface of the first HTS layer. There is a first lamination layer affixed to the first cap layer and a stabilizer layer having a first surface affixed to the second cap layer. There is a second HTS layer and a third cap layer in direct contact with a first surface of the second HTS layer and a fourth cap layer in direct contact with a second surface of the second HTS layer. There is a second lamination layer affixed to the fourth cap layer. The second surface of the stabilizer layer is affixed to the third cap layer and there are first and second fillets disposed along a edge of the laminated superconductor.
Public/Granted literature
- US20180330849A1 HIGH TEMPERATURE SUPERCONDUCTING WIRES HAVING INCREASED ENGINEERING CURRENT DENSITIES Public/Granted day:2018-11-15
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