Invention Grant
- Patent Title: Cooling device and electronic device system
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Application No.: US15899132Application Date: 2018-02-19
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Publication No.: US10772234B2Publication Date: 2020-09-08
- Inventor: Nobuyuki Hayashi
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a3aa95a
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/42 ; H01L23/473 ; H01L23/44

Abstract:
A cooling device includes: coolers; a water-supply pipe that has branch pipes and supplies a coolant to the coolers, each of the branch pipes being coupled with each of the coolers; and a waste pipe that has branch pipes, each of which is coupled with each of the coolers. The coolant having passed through the coolers is exhausted to the waste pipe. The cooling device also includes a circulation pipe that couples an inlet of the water-supply pipe with an outlet of the waste pipe and has a pump to discharge the coolant and a coolant cooler to cool the coolant. The cooling device also includes a bypass flow path that is coupled with at least a top edge portion of the water-supply pipe, bypasses the plurality of coolers, and is coupled with the waste pipe.
Public/Granted literature
- US20180249590A1 COOLING DEVICE AND ELECTRONIC DEVICE SYSTEM Public/Granted day:2018-08-30
Information query