Invention Grant
- Patent Title: Electronic component, electronic device, and method for mounting electronic component
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Application No.: US16197403Application Date: 2018-11-21
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Publication No.: US10772216B2Publication Date: 2020-09-08
- Inventor: Shingo Ito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@d277501
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K3/30 ; H05K3/46 ; H01L23/544 ; H05K1/14 ; H05K1/11

Abstract:
An electronic component includes a multilayer body including insulating base materials laminated on each other and including first and second main surfaces perpendicular or substantially perpendicular to a lamination direction, and an alignment mark is defined by a conductor on one of the insulating base materials. The multilayer body includes a first layer area at a side of the first main surface and a second layer area at a side of the second main surface with respect to the alignment mark. An insulating base material in the first layer area has higher translucency than an insulating base material in the second layer area. The alignment mark is a trapezoidal cross-sectional shape including a first base at the side of the first main surface and a second base at the side of second main surface, the first base being longer than the second base.
Public/Granted literature
- US20190090359A1 ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT Public/Granted day:2019-03-21
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