Invention Grant
- Patent Title: Circuit board, circuit assembly, and circuit board manufacturing method
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Application No.: US16088207Application Date: 2017-04-06
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Publication No.: US10772194B2Publication Date: 2020-09-08
- Inventor: Tou Chin , Arinobu Nakamura
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@31dbdacb
- International Application: PCT/JP2017/014405 WO 20170406
- International Announcement: WO2017/179489 WO 20171019
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/20

Abstract:
A circuit board that includes a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed; a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which an electronic component is placed; and a terminal conductor foil that protrudes inward into the placement through hole from the lower surface and to which a terminal of the electronic component is connected.
Public/Granted literature
- US20190289711A1 CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND CIRCUIT BOARD MANUFACTURING METHOD Public/Granted day:2019-09-19
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