Invention Grant
- Patent Title: Semiconductor integrated circuit
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Application No.: US16170509Application Date: 2018-10-25
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Publication No.: US10770450B2Publication Date: 2020-09-08
- Inventor: Takahide Tanaka
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4f7e7d37
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/761 ; H03K17/00 ; H01L27/06 ; H01L29/739 ; H01L29/78 ; H01L29/861

Abstract:
A semiconductor integrated circuit includes: a p−-type semiconductor substrate defining a high-potential side circuit area and a low-potential side circuit area separated from each other; a high-side n well provided in an upper part of the semiconductor substrate in the high-potential side circuit area; a high-side p well provided in the high-side n well; and a p-type semiconductor region provided in an upper part of the semiconductor substrate in the low-potential side circuit area; and n+-type semiconductor region provided to be brought contact with the p-type semiconductor region, wherein a whole n-type semiconductor region including the n+-type semiconductor region, has an impurity concentration higher than an impurity concentration of the high-side n well.
Public/Granted literature
- US20190189610A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2019-06-20
Information query
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