Invention Grant
- Patent Title: Method for detecting thinning of the substrate of an integrated circuit from its back side, and associated integrated circuit
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Application No.: US16051680Application Date: 2018-08-01
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Publication No.: US10770409B2Publication Date: 2020-09-08
- Inventor: Abderrezak Marzaki , Christian Rivero , Quentin Hubert
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Crowe & Dunlevy
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2c10aee9
- Main IPC: G06K19/073
- IPC: G06K19/073 ; G06F21/75 ; H01L23/00 ; H01L27/02

Abstract:
An integrated electronic circuit includes a semiconductor substrate with a semiconductor well that is isolated by a buried semiconductor region located under the semiconductor well. A vertical MOS transistor formed in the semiconductor well includes a source-drain region provided by the buried semiconductor region. Backside thinning of the semiconductor substrate is detected by biasing the vertical MOS transistor into an on condition to supply a current and then comparing that current to a threshold. Current less than a threshold is indicative that the semiconductor substrate has been thinned from the backside.
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