Invention Grant
- Patent Title: Lift pin assembly, substrate support apparatus and substrate processing apparatus having the same
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Application No.: US15944909Application Date: 2018-04-04
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Publication No.: US10770337B2Publication Date: 2020-09-08
- Inventor: Ja-Woo Lee , Seung-Won Shin , Su-Ho Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2910e8ef
- Main IPC: B23P19/04
- IPC: B23P19/04 ; H01L21/687 ; H01L21/67 ; H01L21/683 ; G03F7/20 ; H01J37/32

Abstract:
A lift pin assembly includes a lift pin having a first longitudinal axis substantially parallel with a first direction, a pin connection block combined with a lower end portion of the lift pin and including a first guide recess in a lower end portion of the pin connection block, the first guide recess extending in a second direction substantially perpendicular to the first direction, and a lift pin holder having a second longitudinal axis substantially parallel with the first direction and including a first sliding portion to be received movably in the second direction within the first guide recess by an eccentricity distance of the second longitudinal axis from the first longitudinal axis when the lift pin holder is connected to the lower end portion of the pin connection block.
Public/Granted literature
- US20190080955A1 Lift Pin Assembly, Substrate Support Apparatus and Substrate Processing Apparatus Having the Same Public/Granted day:2019-03-14
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