Invention Grant
- Patent Title: Semiconductor device and method of forming the same
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Application No.: US16726012Application Date: 2019-12-23
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Publication No.: US10770299B2Publication Date: 2020-09-08
- Inventor: Li-Jung Liu , Chun-Sheng Liang , Shu-Hui Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/165

Abstract:
A semiconductor device includes a semiconductor fin and a gate structure. The semiconductor fin extends along a first direction above a substrate. The gate structure extends across the semiconductor fin along a second direction substantially perpendicular to the first direction. The gate structure includes a chlorine-containing N-work function metal layer wrapping around the semiconductor fin, and a filling metal over and in contact with the chlorine-containing N-work function metal layer.
Public/Granted literature
- US20200135477A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2020-04-30
Information query
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