Invention Grant
- Patent Title: Shielded conductive path
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Application No.: US16637798Application Date: 2018-07-18
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Publication No.: US10770200B2Publication Date: 2020-09-08
- Inventor: Hirokazu Nakai
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@d4a388b
- International Application: PCT/JP2018/026807 WO 20180718
- International Announcement: WO2019/031167 WO 20190214
- Main IPC: H01B7/18
- IPC: H01B7/18 ; H01B7/02 ; H01B7/00 ; B60R16/02

Abstract:
It is aimed to realize a height reduction of a shielded conductive path and improve a heat dissipating function. In a shielded conductive path (W) in which a plurality of conductive members (1) each including a conductor portion (2), an insulating portion (3) and a shield portion (4) disposed from a central part toward an outer peripheral side are arranged in parallel, at least one of the conductor portion (2), the insulating portion (3) and the shield portion (4) is formed by a shape retaining member capable of retaining each conductive member (1) in a set shape.
Public/Granted literature
- US20200258657A1 SHIELDED CONDUCTIVE PATH Public/Granted day:2020-08-13
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