Invention Grant
- Patent Title: Component mounting apparatus and component mounting method
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Application No.: US15695324Application Date: 2017-09-05
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Publication No.: US10766073B2Publication Date: 2020-09-08
- Inventor: Yoichi Makino
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@770aff5
- Main IPC: H05K3/30
- IPC: H05K3/30 ; B23B3/32 ; B23P21/00 ; B23P19/04 ; B23B9/00 ; B23B13/12 ; H05K1/02 ; H05K13/00 ; H05K13/04

Abstract:
After a chuck portion chucks a workpiece holding body which aligns and holds a plurality of workpieces on which components are to be placed, the posture of the workpieces held in the workpiece holding body is adjusted due to rotation mechanism by rotating the chuck portion around an axial line which extends in an aligning direction of the plurality of workpieces held in the workpiece holding body. Then, a placing head places the components on each of the plurality of workpieces which are subjected to posture adjustment.
Public/Granted literature
- US20180093328A1 COMPONENT MOUNTER AND COMPONENT MOUNTING METHOD Public/Granted day:2018-04-05
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