- Patent Title: Embedding component with pre-connected pillar in component carrier
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Application No.: US16169741Application Date: 2018-10-24
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Publication No.: US10765005B2Publication Date: 2020-09-01
- Inventor: Hannes Stahr , Hannes Voraberger , Andreas Zluc , Bettina Schuster
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@13e23ff6
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K3/34 ; H05K3/40 ; H01L23/00 ; H05K3/00 ; H01L23/538
Abstract:
A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.
Public/Granted literature
- US20190124772A1 Embedding Component With Pre-Connected Pillar in Component Carrier Public/Granted day:2019-04-25
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