Invention Grant
- Patent Title: Semiconductor device for logic and memory co-optimization
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Application No.: US16441682Application Date: 2019-06-14
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Publication No.: US10763863B2Publication Date: 2020-09-01
- Inventor: Jhon Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H03K19/00 ; H03K19/1776 ; H01L27/105 ; H03K19/20

Abstract:
Structures and methods for the co-optimization of core (logic) devices and SRAM devices include a semiconductor device having a logic portion and a memory portion. In some embodiments, a logic device is disposed within the logic portion. In some cases, the logic device includes a single fin N-type FinFET and a single fin P-type FinFET. In some examples, a static random-access memory (SRAM) device is disposed within the memory portion. The SRAM device includes an N-well region disposed between two P-well regions, where the two P-well regions include an N-type FinFET pass gate (PG) transistor and an N-type FinFET pull-down (PD) transistor, and where the N-well region includes a P-type FinFET pull-up (PU) transistor.
Public/Granted literature
- US20200106441A1 SEMICONDUCTOR DEVICE FOR LOGIC AND MEMORY CO-OPTIMIZATION Public/Granted day:2020-04-02
Information query
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