Invention Grant
- Patent Title: Processor comprising three-dimensional memory (3D-M) array
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Application No.: US15487366Application Date: 2017-04-13
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Publication No.: US10763861B2Publication Date: 2020-09-01
- Inventor: Guobiao Zhang , Chen Shen
- Applicant: Guobiao Zhang , Chen Shen
- Applicant Address: CN HangZhou, ZheJiang US OR Corvallis
- Assignee: HangZhou HaiCun Information Technology Co., Ltd.,Guobiao Zhang
- Current Assignee: HangZhou HaiCun Information Technology Co., Ltd.,Guobiao Zhang
- Current Assignee Address: CN HangZhou, ZheJiang US OR Corvallis
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@78b01cb2 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5e7720be com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4f7708cd com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@cae2040
- Main IPC: H03K19/17728
- IPC: H03K19/17728 ; G06F15/78 ; G06F7/487

Abstract:
The present invention discloses a processor comprising three-dimensional memory (3D-M) array (3D-processor). Instead of logic-based computation (LBC), the 3D-processor uses memory-based computation (MBC). It comprises an array of computing elements, with each computing element comprising an arithmetic logic circuit (ALC) and a 3D-M-based look-up table (3DM-LUT). The ALC performs arithmetic operations on the LUT data, while the 3DM-LUT is stored in at least one 3D-M array.
Public/Granted literature
- US20170237440A1 Processor Comprising Three-Dimensional Memory (3D-M) Array Public/Granted day:2017-08-17
Information query
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