Invention Grant
- Patent Title: Acoustic wave device
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Application No.: US15694069Application Date: 2017-09-01
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Publication No.: US10763818B2Publication Date: 2020-09-01
- Inventor: Takeshi Sakashita , Jun Tsutsumi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@635771b0
- Main IPC: H03H3/08
- IPC: H03H3/08 ; H03H3/10 ; H03H9/145 ; H03H9/25 ; H03H9/02 ; H01L41/047 ; H01L41/187 ; H03H9/64

Abstract:
An acoustic wave device includes: a piezoelectric substrate; a comb-shaped electrode located on the piezoelectric substrate; a wiring layer located on the piezoelectric substrate and electrically connected with the comb-shaped electrode; a first insulating film located on the piezoelectric substrate, the first insulating film covering the comb-shaped electrode, having an aperture on the wiring layer, and being thicker than the comb-shaped electrode; a second insulating film covering an upper surface of the first insulating film and at least a part of a side surface of the first insulating film in the aperture and having a higher moisture resistance than the first insulating film; and a pad being in contact with the wiring layer exposed by the aperture.
Public/Granted literature
- US20180083593A1 ACOUSTIC WAVE DEVICE Public/Granted day:2018-03-22
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