Invention Grant
- Patent Title: Light emitting device package
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Application No.: US16238046Application Date: 2019-01-02
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Publication No.: US10763398B2Publication Date: 2020-09-01
- Inventor: Wong Jung Kim , June O Song , Ki Seok Kim , Chang Man Lim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a898caa
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48 ; H01L33/56 ; H01L33/60 ; H01L33/62 ; H01L33/50

Abstract:
A light emitting device package according to an embodiment includes: a body including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, and first and second openings passing through the upper surface and the lower surface; and a light emitting device including first and second bonding portions disposed on the first and second openings, respectively, wherein the body may include a recess provided on the lower surface, the recess may be vertically overlapped with the first opening and the second opening, and the recess may be exposed at the side surface of the body.
Public/Granted literature
- US20190207062A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2019-07-04
Information query
IPC分类: